Wafer Coating Thickness Instrument XUV 773

Wafer coating thickness instrument is one of the most favored device of the market due to accurate designs and exceptional accuracy. Our range of Wafer Coating Thickness is high in performance with modern vacuum chamber for non-destructive coating thickness measurements and material examination. Designed as per international industrial standards, our offered devices are used for non-destructive study of thin coatings, light and traces elements. Up to 24 elements of sodium (11) to uranium (92) range can be easily determined at the same time. Ergonomically designed, they are used in vacuum, ambient air or using helium purge (optional).

Applications

General Specification

Intended use:Energy dispersive X-ray fluorescence measuring instrument (EDXRF) coatings, trace elements, small structures, and alloys.

Element range:Sodium Na (11) to Uranium U (92) - up to 24 elements simultaneously.

Design: Helium purge of measurement chamber (optional)

Bench top unit with motorized opening cylindrical vacuum chamber.

Programmable motorized X/Y/Z sample stage

External vacuum pump.

High resolution color video camera with a wide magnification range.

Measuring direction:Top down

X-Ray Source

X-ray tube:Micro focus X-ray tube with Rhodium target

(Tungsten, Molybdenum, or other target materials as option)

High voltage:Three steps: 8 kV, 20 kV, 50 kV

Aperture (Collimator):4x changeable:  0.1 mm (3.9 mils),  0.3 mm (11.8 mils),  1 mm (39.4 mils), 3 mm (118 mils), others on demand

Primary filter:6x changeable: Ni 10m (0.39 mils), free, Al 1000 m (39.4 mils), Al 500 m (19.7 mils), Al 100 m (3.94 mils), Mylar® 100m (3.94 mils)

Measurement spot:Depends on measurement distance and used aperture.

Smallest measurement spot: approx.  0.15 mm (5.9 mils).

Real spot size is displayed on the video screen.

X-Ray Detection

X-ray detector:SDD Silicon Drift Detector, peltier-cooled

Resolution (fwhm for Mn-K±): 140 eV

Measurement distance:0 -20 mm (0-0.8 in), Distance compensation with patented DCM method for simplified measurements at varying distances. For particular applications an additional calibration might be necessary.

 

Sample Alignment

Video microscope:High-resolution CCD color camera for optical study of the measurement location along the manual focusing and auto-focus, primary beam axis, crosshairs with a calibrated scale (ruler) and spot-indicator, Laser pointer (class 1) and adjustable LED illumination of the measurement.

Video magnification factor:20x  180x (optical: 20x  45x; digital: 1x, 2x, 3x, 4x)

Sample Stage

Design:Fast motorized and programmable X/Y/Z sample stage

Travel distance:X-/ Y-/ Z-axis [mm]:100 x 100 x 100, [in]: 3.94 x 3.94 x 3.94

Repeatability precision XY:  0,01 mm (0.39 mils), uni-directional

Support area:Width x depth [mm]: 135 x 135, [in]: 5.31 x 5.31

Max. sample weight:  1 kg (2.2 lb)

Max. sample height:100 mm (3.94 in)

 

Electrical Data

Power supply:AC 115 V or AC 230 V 50 / 60 Hz

Power consumption:Max. 120 W ,without evaluation PC

Protection class:IP40

Dimensions

External dimensions:Width x depth x height [mm]: 640 x 640 x 760 mm, [in]: 25.2 x 25.2 x 29.2

Interior dimensions: Diameter x depth [mm]: 400 x 390, [in]: 15.8 x 15.3

of chamber:

Weight:approx. 182 kg (401 lb)

Environmental Conditions

Operating temperature:10^oC - 40^oC (50^oF - 104^oF) around the housing

Storage temperature:0^oC - 50^oC (32^oF - 122^oF)

Admissible air humidity:  95 %, non-condensing

Evaluation Unit

Computer:Windows®-PC

Software:Standard: Fischer WinFTM® BASIC including PDM®

Optional: Fischer WinFTM® SUPER

Standards

CE approval:EN 61010

X-Ray standards:DIN ISO 3497 and ASTM B 568

Approval:Individual acceptance inspection as a fully protected instrument according to the German regulations.

Product details 

Aperture	4x changeable
Brand	Fischer
Power Supply	AC 115 V or AC 230 V 50 / 60 HzAC 115 V or AC 230 V 50 / 60 Hz
Protection Class	IP40
Power Consumption	Max. 120 W
Dimension	660 x 835 x 720 mm
Design	Bench-top unit with hood opening