Wafer And Lead Frame Coating Thickness Measurement

Wafer and Lead Frame Coating Thickness Measurement instrument is used as non destructive testing solution for precious jewelry made of gem stones and gold and for analyzing trace elements as per WEEE and RoHs standards. Known for its prolonged service life, this coating thickness measuring system is also used for determining coating attributes of CdTe and CIS coatings. This instrument tests coating density under specific air or vacuum pressure. In special cases, it conducts testing under helium pressure. This Wafer and Lead Frame Coating Thickness Measurement instrument can measure fluid based or wet sample under helium pressure. Its x ray fluorescence based measurement method maintains accuracy of coating and precision of analysis. This meticulously designed apparatus can be used for assessing coating attributes of lead frame and PC boards. Perfect for micro analysis purpose, this instrument has large measurement chamber with C slot.

Features:

1) This coating thickness measuring solution is suitable for uniform or almost plain surface.
2) Its programmable XY stage promotes its automatic operation.
3) Long working life.
4) User friendly design.