Coating Thickness
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Fischer measurement Technologies (India) Pvt. Ltd.

Coating Thickness EDXRF(Energy Dispersive XRF)


Bath Analysis

We are engaged in offering a wide range of bath analysis. These are engineered in accordance with international industrial standard and using best available techniques. These are available with us in various range including plating bath analysis instrument – XUL, bath analysis coating thickness – XDL, bath analysis coating thickness - XAN 250, bath analysis coating thickness - XDV-SDD and bath analysis coating thickness – XDLM.

Coating Thickness Measurement on Connectors

Determination of the thickness of typical contact coatings such as Au/Ni/Base, SnPb/Ag/Ni/Base, Au/PdNi/Ni/Base etc with XRF instruments.

PCB

Specific X-ray Fluorescence Measuring Instruments (XRF) for Measurements and Analyses of Coating Thicknesses and Compositions on Printed Circuit Boards. Also determination of copper coating thickness on non-etched or etched PC boards and determination of copper coating thickness in bore holes using handheld instruments.

Wires

Determination of the coating thickness of tin, silver and zinc coatings on copper wires or copper coatings on iron wires with XRF instruments.

Solder Joints

Solder joints are engineered using best available techniques and following international industrial standard. These are extensively recommended by clients owing to its precise design and effective usage. These are available in various range including solder joints coating thickness measurement - XDLM 237, solder joints coating thickness measurement - XDV-SDD and solder joints coating thickness measurement - XDV-u

Wafer & Lead Frame

High Repeatability Precision and Trueness of Au / Pd Coating Measurements on Leadframes along with Specific X-ray Fluorescence Measuring Instruments (XRF) for Measurements and Analyses of Coating Thicknesses and Compositions on Wafers for Measurements on structures on wafers in the electronics and semiconductor industries

Wafer Coatings

Specific X-ray Fluorescence Measuring Instruments (XRF) for Measurements and Analyses of Coating Thicknesses and Compositions on Wafers
The instruments are particularly suitable for measurements on structures on wafers in the electronics and semiconductor industries, Analysis of very thin coatings, e.g., gold/palladium coatings of ≤ 0.1 μm (0.004 mils) & Determination of complex multi-coating systems Automated measurements, e.g., in quality control

Analysis of Thin-Film Solar Cells

Production quality of thin film solar cells can be accurately and precisely monitored using the X-Ray Fluorescence (XRF) methodology. Specifically tailored inline measurement instruments are available that fulfil the robustness requirements in production environment. Clever software features enable simple setup and handling of the measurement instruments whilst ensuring stable measurement and maintaining comparability between them.

PVD & CVD Coating

Measurement of the coating thickness of hard material coatings such as TiN, TiCN, CrN or CrVN using the X-ray fluorescence (XRF) measuring instruments FISCHERSCOPE X-RAY XDAL and XDV-SDD along with Measurement of the coating thickness of thin coatings such as DLC coatings using the beta backscatter method in the FISCHERSCOPE® MMS® PC2

Coating Thickness Measurement on Watches

Watch hands, faces, gear wheels and other visible elements inside high quality watches are often plated with gold or other precious metals that lend the watch its elegant look. Here, not only is the visual effect important but also the precise functioning of the parts. Tight tolerance limits require extremely precise coating thickness measurements, such as those achieved using X-ray fluorescence

ROHS/WEEE/EOLV/CPSIA

X-ray fluorescence instrument for measuring very small concentrations of harmful substances such as Pb, Hg and Cd with detection limits of a few ppm– FISCHERSCOPE X-RAY XDV-SDD, XAN 250 with SDD detector, or XDAL with PIN detector

Electroplating and Electroless Coatings

The combination of state-of-the-art detector technology such as SDD, multiple excitations in various modes, and the powerful analysis software, WinFTM® , allows for reliable, accurate measurements of both coating thickness of electroplated materials and phosphorous content of electroless nickel coatings on a wide variety of substrate materials. The XRF machine unites all these performance features in one instrument.
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